In August, Toshiba starts mass production and shipments of its 40V N-channel power MOSFETs - “TPWR7904PB” and “TPW1R104PB”, for automotive applications. They will be available in DSOP Advance(WF) packages that comes with double-sided cooling, low resistance, and small size.
The power MOSFETs secure high heat dissipation and low On-resistance characteristics by mounting a U-MOS IX-H series chip, which comes with the latest trench structure, into a DSOP Advance(WF) package. It enables the heat generated by conduction loss to be effectively dissipated, improving the flexibility of thermal design.
The U-MOS IX-H series MOSFETs also deliver lower switching noise than Toshiba’s previous U-MOS IV series, contributing to lower EMI. The DSOP Advance(WF) package has a wettable flank terminal structure.
The devices are qualified for AEC-Q101, thus suitable for automotive applications; and comprise features such as double-sided cooling package with top plate and drain, improved AOI visibility due to wettable flank structure, and low On-resistance and low noise characteristics. They can be used in automotive applications like Electric power steering, Load switches and Electric pumps.
Main Specifications (@Ta=25℃)
|
Part number |
Absolute maximum ratings |
Drain-source On-resistance |
Built-in Zener Diode between Gate-Source |
Series |
Package |
||
|
Drain- source voltage VDSS |
Drain current (DC) ID |
@VGS＝ |
@VGS= 10V |
||||
|
TPWR7904PB |
40 |
150 |
1.3 |
0.79 |
No |
U-MOS IX-H |
DSOP Advance(WF)L |
|
TPW1R104PB |
120 |
1.96 |
1.14 |
DSOP Advance(WF)M |
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