Infineon Technologies introduced XENSIV IM67D130A to address the need for high-performance, low-noise MEMS microphones for automotive applications. This new device in the PG-LLGA-5-4 package is fully qualified for the AEC-Q103-003 standard for automotive applications and can help simplify the design-in efforts for the industry and reduce the risk of qualification fails.
Providing the best possible fit for automotive applications, the XENSIV MEMS microphones are well suited to all applications inside and outside the car where the best audio performance in harsh automotive environments is required. The device has an increased operating temperature range from -40°C to +105°C to enable various use cases in harsh automotive environments.
The high acoustic overload point (AOP) of 130 dB SPL of the XENSIV IM67D130A microphone enables it to capture distortion-free audio signals in loud environments. The IM67D130A microphone can be placed inside or outside of the vehicle and is ideal for in-cabin applications such as hands-free systems, emergency calls, in-cabin communication, and active noise cancellation (ANC).
The high signal-to-noise ratio (SNR) of 67 dB along with low distortion level ensures optimum speech quality and superior speech intelligence for applications based on speech recognition. Additionally, the microphones have tight sensitivity matching allowing optimized beamforming algorithms for multi-microphone arrays. The extended availability of these silicon XENSIV MEMS microphone IM67D130A devices matches the typical long lifecycle of a vehicle.
Key Features of XENSIV IM67D130A Microphone
- The high dynamic range of 103 dB for best speech performance
- Signal-to-noise ratio of 67 dBSPL
- <1% total harmonic distortions up to high SPL levels
- Acoustic overload point at 130 dBSPL
- Increased operating temperature range: TA = -40°C… 105 °C
- Digital PDM output
- Automotive qualification according to AEC-Q103-003
