Texas Instruments (TI) has launched six new power modules designed to enhance power density, efficiency, and EMI (Electromagnetic Interference) reduction. These new modules feature TI's MagPack integrated magnetic packaging technology, which makes the modules up to 23% smaller than those from competing brands. This reduction in size enables designers in various fields, including industrial, enterprise, and communications applications, to achieve higher performance levels within constrained spaces. Among the newly introduced devices, the TPSM82866A, TPSM82866C, and TPSM82816 stand out as the smallest 6A power modules available. These modules deliver an industry-leading power density of nearly 1A per 1mm² of area, making them highly efficient for their size.
MagPack technology integrates a power chip with a transformer or inductor into a single package, leveraging a 3D package molding process. This process optimizes the module's dimensions—height, width, and depth—allowing for more power to be accommodated within a smaller footprint. Additionally, the integrated magnetic packaging features a power inductor made from newly developed materials. This innovation enhances power density and reduces both the operating temperature and radiated emissions. These improvements are particularly beneficial for applications such as data centers, where efficient power usage is critical due to high electricity demands.
