Infineon Technologies AG has launched next-generation XENSIV MEMS microphones IM69D127, IM73A135, and IM72D128 that are designed to capture audio signals with the highest precision and quality and are based on Infineon’s latest Sealed Dual Membrane (SDM) MEMS technology which delivers high ingress protection (IP57) at a microphone level.
These MEMS microphones are suitable for consumer electronics such as headphones with active noise cancellation (ANC), TWS earbuds, conference devices with beamforming capability, laptops, tablets, or smart speakers with voice-user interfaces. Moreover, use cases also include selected industrial applications such as predictive maintenance and security.
The analog microphone IM73A135 features a best-in-class signal-to-noise ratio (SNR) of 73 dB(A) and an excellent acoustic overload point (AOP) of 135 dB SPL (sound pressure level). Whereas its digital counterpart, the IM72D128, offers an SNR of 72 dB(A) and an AOP of 128 dB SPL. IM69D127 features similar performance condensed into a tiny 3.60 x 2.50 mm 2 package.
Key Features
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Ultra-low self-noise / ultra-high SNR
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Selectable power modes
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Sealed Dual Membrane (SDM) technology with ingress protection at microphone level
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Extremely low distortions (THD) even at high sound pressure levels
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High dynamic range and very high acoustic overload points (AOP)
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Very tight part-to-part phase and sensitivity matching
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Flat frequency response with a low LFRO (low frequency roll-off)
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Ultra-low group delay
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Very small package sizes
Additionally, all devices feature extremely low distortions (THD) even at high sound pressure levels, very tight part-to-part phase and sensitivity matching, as well as a flat frequency response with a low FRO (low frequency roll-off), an ultra-low group delay, and selectable power modes.
