Texas Instruments has announced a new DC/DC Buck Converter Module called TPSM53604, which is claimed to be the smallest 36V, 4A power module in a quad flat no-lead (QFN) package. The new DC/DC buck module’s small footprint (5mm x 5mm) allows the engineers to reduce the size of their power supply by 30% with reduced power loss up to 50% when compared with other similar products. The new device also allows the engineers to simplify the board mounting and layout with its single thermal pad to optimize heat transfer.
TPSM53604 is the smallest solution for common 24V, 4A industrial application for a single-sided layout. 42% of the TPSM53604’s QFN package footprint touches the board, enabling more efficient heat transfer compared to competing for ball-grid-array (BGA) packages. The module’s buck converter integrates MOSFETs with low drain-source on-resistance (RDS(on)) to enable conversion efficiency of 90% at 24 V to 5 V.
The TPSM53604 integrates high-frequency bypass capacitors and a lack of bond wires to help the engineers meet EMI standards. The device can operate in ambient temperature as high as 105°C, this makes it suitable for rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defense. For more information about TPSM53604, read the datasheet.
