STMicroelectronics has come up with high-speed image sensors that use a global shutter for capturing distortion-free images when in motion or when near-infrared illumination is required. The new sensors namely VD55G0 with 640 x 600 pixels and the VD56G3 with 1.5 Mpixels (1124 x 1364) measure 2.6mm x 2.5mm and 3.6mm x 4.3mm, respectively. This makes them the smallest sensors available in the market.
The lately introduced sensors are apt for a wide range of applications like Augmented and Virtual Reality (AR/VR), Simultaneous Localization and Mapping (SLAM), and 3D scanning. The sensors are based on ST's third generation of advanced pixel technology and promise to enhance performance, size, and system integration. Features like low pixel-to-pixel crosstalk at all wavelengths, specifically near-infrared ensure superior image clarity. Moreover, the sensors save all pixel data in each frame simultaneously.
Deep Trench Isolation (DTI) is the advanced pixel technology from ST that enables extremely small 2.61μm x 2.61μm pixels that combine low Parasitic Light Sensitivity (PLS), high Quantum Efficiency (QE), and low crosstalk in a single die layer. Moreover, the ST approach enables a small pixel on a backside illumination (BSI) die, thereby allowing space-saving vertical stacking of the optical sensor and associated signal-processing circuitry on the bottom die to achieve an extremely small sensor size and to embed a greater number of key features like fully-autonomous optical flow block and more.
According to the company, these new sensors are a step forward in computer-vision applications and will enable designers to create smart, autonomous industrial and consumer devices. The samples are being shipped to lead customers and you can connect with your ST sales office to know about the pricing and for making sample requests.
