Infineon Technologies AG has announced the launch of its new power semiconductors with CoolSiC MOSFET and .XT technology in the XHP 2 package tailored specifically to the requirements of rail services. In this XHP 2 power module, CoolSiC MOSFET chips enable low conversion losses while maintaining high reliability and are the basis for increased energy efficiency and are already used today in many applications like photovoltaic systems.
Infineon's .XT technology significantly improves the lifetime during power cycles and has been used successfully for years in similarly challenging applications such as wind turbines. Implementing SiC in power modules for traction propulsion systems can also pose major challenges. Moreover, Infineon's XHP 2 package features low stray inductance, a symmetrical and scalable design, and high current capacity.
