Nexperia has announced its latest product additions to a growing range of discrete devices which are available in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. Leadless DFN packages are up to 90% smaller than SOT23 packages and this helps to reduce the amount of board space required for the rapidly increasing number of electronic components being used in the latest vehicles.
The side-wettable flank feature offers very reliable automated optical inspection (AOI) of solder joint quality. Nexperia’s DFN packages deliver excellent thermal performance with high Ptot and are also the most rugged in the industry passing extended lifetime and reliability tests.
The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes:
- BC817QBH-Q and BC807QBH-Q series 45V, 500mA NPN/PNP general-purpose transistors in DFN1110D-3.
- BAT32LS-Q and BAT42LS-Q general purpose Schottky diode in DFN1006BD-2
- BAS21LS-Q high-speed switching diode in DFN1006BD-2 package.
- PDTA143/114/124/144EQB-Q series 50V 100mA PNP Resistor-Equipped Transistor (RET) family in DFN1110D-3 package.
- 2N7002KQB – 60 V N-channel Trench MOSFET and BSS84AKQB – 50 V, P-channel Trench MOSFET in DFN1110D-3 package.
