The Texas Instruments has introduced a family of four high efficiency, low quotient current (IQ) buck boost converter that is designed with tiny spacing with minimal external component for a compact solution size. The integrated TPS63802, TPS63805, TPS63806 and TPS63810 DC/DC noninverting buck-boost converters offer a wide 1.3V to 5.5V input and 1.8V to 5.2V output voltage range that scale to support multiple battery driven application, which helps the engineers to simplify and accelerate the design and encourages reuse across multiple applications.
The complete solution is delivered within the size of 19.5 mm2 to 25 mm2, which is 25% smaller than similar devices, this resulted in compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors and tiny 0.47µH inductors. These DC/DC converters that can automatically select buck, buck-boost or boost mode according to the operating conditions, are a new addition to TI’s industry leading low IQ Power management portfolio provide low 11- to 15-µA IQ For excellent light load efficiency while minimizing power losses and extending run times in battery driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.
TSP638xx family – Features
- TPS63802 : 2-A buck-boost converter with low 11-µA IQ consumption, suitable for pulsed-load applications such as industrial Internet of Things devices.
- TPS63805 : 2-A buck-boost converter with a 22-µF output capacitor and 0.47-µH inductor ,small solution size of 19.5 mm2, meets the requirements of handheld industrial and personal electronics applications.
- TPS63806 : 2.5-A buck-boost converter which focuses on improved load-step regulation for applications with an aggressive load profile that require tight regulation, such as time-of-flight sensors in smartphones, cameras or augmented reality devices.
- TPS63810 : 2.5-A buck-boost converter with I2C interface for dynamic voltage scaling through either a two-wire interface or the VSEL pin, enabling the device to serve as a pre-regulator or voltage envelope tracker for systems found in smartphones, wireless hearing aids or headphones.
The TPS63805 is packed in 10-pin, 2-mm-by-3-mm thermally enhanced HotRod quad flat no-lead (QFN) and the TPS63805 is packed in 15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA) is available in production quantities through the TI store and authorized distributors for $0.98/1000 unit. The preproduction samples are also available for TPS63806 and TPS63810 which are packed in 15 pin, 1.4mm by 2.3mm DSBGA. The TPS63806 has been priced $1.05/ 1000 unit and TPS63810 has been priced $1.09/ 1000 unit. More technical details can be found in the datasheet(TPS63802) available in the official product page of Texas instruments.
