high power density

	New CoolSiC MOSFETs 650 V G2 in TOLT and Thin-TOLL Package Increase System Power Density Infineon Technologies AG has expanded its portfolio of CoolSiC MOSFET discretes 650 V with two new product…
	EconoDUAL 3 Portfolio Enhanced with New Current Ratings for Increased Power Density and Performance Infineon Technologies has enhanced its 1200 V EconoDUAL 3 portfolio with the TRENCHSTOP IGBT7 chip by offering new current…
	New surface mount inductors to meet complex requirements of today’s high power density TT Electronics announced two new surface mount device (SMD) power inductors: the HM66M series for use in high frequency…

	USB-TEMP/-TC Series USB Temperature Measurement Devices Measure thermocouples and RTD’s with Digilent USB-based DAQ devices.
	RF Technology Solutions Infineon’s RF solutions are ideal for wireless infrastructure, wearables, and FM portable devices.
	InnoSwitch3-EP InnoSwitch™3-EP family of offline CV/CC QR flyback switcher ICs feature 900 V PowiGaN™ GaN switches.
	ECX-1637B Low-Aging Compact Crystal The ECX-1637B is a low-aging crystal. This component is ideal for wireless and IoT applications.
	Digi-Key Digital Solutions Simplify your B2B ordering process with three integration options: API, EDI, and Punchout.
	ACS71240 Current Sensors The ACS71240 is designed to replace shunt resistors in applications that require small size.
	Johanson Technology Inc. 0898CP14C0035001T Compact 900MHz coupler for ISM, LoRa®, IoT. EIA 0603, RoHS compliant for seamless PCB integration.
	AKX00069 Plug and Make Kit Arduino’s Plug and Make Kit is the perfect solution to seamlessly integrating hardware.

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